The Global non-UV dicing tapes market size was $1.59 billion in 2022, and is anticipated to grow to a value of more than $2.13 billion by 2030, with a growing CAGR (compound annual growth rate) of over 6% from 2022 to 2030.
The type of adhesive tapes most frequently used to seal big die sizes in the electronics industry are non-UV dicing tapes. Due to their capacity to provide high adherence even when a surface is exposed to Ultraviolet radiation, these tapes shield semiconductor surfaces from wafers. Due to the non-halogen PET, PO, and Polyvinyl chloride used in their construction, these dicing tapes are extensible.
Non-UV dicing tapes are used in the electronics industry for large die sizes. It is composed of flexible films, the majority of which are constructed of PVC. They are used in many different applications, such as wafer and packaging dicing. The process of wafer back grinding, which is applicable in the process of gaining significant momentum among the water fabrication industry, uses non-UV dicing tapes. With lower switching costs, thin wafers continue to be useful in producing energy-efficient end products. As a result, it also increases the demand for non-UV dicing tapes and accelerates market growth.
Because of technological improvements and growing consumer demand for aesthetically thin electrical products, manufacturers are flattening their wafers. As a result, there will be a rise in the demand for Non-UV Dicing Tapes during the forecasted period. The increased supply for electrical and electronic equipment in the coming years should present opportunity for manufacturers of non-UV dicing tapes. The growing demand for products like electronics and computers is to blame. It has consequently raised demand for PCBs and chips. As a result, the market for Non-UV Dicing Tapes is predicted to experience growth during the forecast period.
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Rise in demand of Electronic and communication Sector:
Due to the demand for portable electronics components and semiconductors, which lower the size of electronic gadgets or appliances making them easier to handle and transport, the worldwide electronics and semiconductor sector is anticipated to rise. Because of the excellent adhesive strength and temperature and pressure tolerance of polyolefin UV tapes, the market for these products is anticipated to expand in the years to come. The development of the global electronics and semiconductor industries has paved the way for Non-UV/ UV dicing tapes. The demand for Compact electronic components like ICs and electronic chips is what drives the market for dicing tapes.
Global Non-UV Dicing Tapes Market: Segment Assessment
Based By Material Type:
- PVC
- PET
- PO
- Others (EVA, etc)
Based By Thickness:
- 85-125 Micron
- 126-150 Micron
- Below 85 Micron
- Above 150 Micron
Based By Coating Type:
- Single sided
- Double sided
Based By Application:
- Wafer dicing
- Package dicing
- Others (Glass, ceramics)
Key companies profiled:
- Pantech Tape Co. Ltd.
- Furukawa Electric Co. Ltd.
- Mitsui Chemicals Inc.
- AI Technology, Inc.
- LINTEC Corporation
- Pantech Tape Co. Ltd
- QES GROUP BERHAD
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