Embedded Die Packaging Technology Market size was valued at $63.93 million in 2020, and is projected to reach $311.41 million by 2030, registering a CAGR of 18.2% from 2021 to 2030.
Benefits of embedded die packaging technology include improved electrical and thermal performance, heterogeneous integration, easier OEM logistics, and the potential for cost savings.The primary reason fueling the growth of the embedded die packaging technology market is the high deployment of autonomous robots for professional services. Furthermore, the market for integrated die packaging technology is anticipated to grow as a result of the expanding population, rising disposable income, enhanced telecommunications infrastructure, and rising IoT use. However, the market for embedded die packaging technology is constrained by the high cost of these chips, and the reduced power loss of the system will inhibit market expansion.
One of the key elements contributing to the growth of embedded die technology is the rising popularity of smartphones and wearable technologies. These devices utilise embedded die packaging technology in their design to make the best use of the space available for adding more components.
Moreover, the emergence of the Internet of Things (IoT) and connected gadgets has increased demand for embedded die packaging technologies. Another important aspect driving the market expansion for integrated die technology is the growing need for portable electronic gadgets.
But the cost factor is one of the main things holding back the development of embedded die technology. The yield is low and embedded die costs are still too expensive.
Using a multi-step manufacturing process, embedded die packaging technology embeds the components inside the substrate. In the centre of an organic substrate, a die, several dies, or a passive can be placed in a side-by-side configuration. Copper-plated vias, which are located on the board and save up space in the system, are used to connect the components. It is projected that the less storage advantage will increase demand for embedded die packaging technology. The demand for embedded die packaging technology is a result of technological improvements and developments. Embedding technologies to meet diverse requirements, such as those related to chip size, electrical performance, and interconnection. Because embedded components can be stacked in several layers with embedded components, miniaturisation allows for more flexible design and larger board layouts. This will probably encourage the market for embedded die to increase.
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Global Embedded Die Packaging Technology Market: Major Players
Taiwan Semiconductor Manufacturing Company
Fujikura
MicroSemi
AT & S
Amkor Technology
TDK-Epcos
ASE Group
Infineon
General Electric
Schweizer
Global Embedded Die Packaging Technology Market: By Types
Embedded Die in IC Package Substrate
Embedded Die in Rigid Board
Embedded Die in Flexible Board
Global Embedded Die Packaging Technology Market: By Applications
Consumer Electronics
IT & Telecommunication
Automotive
Healthcare
Others
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